High-Temperature Laminated Busbars: Breaking the 150℃ Limit, Empowering Next-Generation Power Electronics

In cutting-edge fields such as SiC power modules, AI computing power, super charging, and high-density power electric drives, long-term high-temperature environments and harsh reflow soldering processes are becoming bottlenecks for traditional busbar technology. Centered on independently developed high-temperature resistant adhesive and PI material, A&J Link launches a new high-temperature laminated busbar, redefining the reliability boundary of power interconnection.

Core Technical Advantages

1. Extreme High Temperature Resistance, Ready for Extreme Operating Conditions

· Long-term operating temperature: Stably supports continuous operation above 150℃, adapting to long-term high-temperature scenarios

· Instantaneous temperature peak: Up to 280℃, capable of directly withstanding the extreme thermal shock of reflow soldering

· Material guarantee: PI substrate + self-developed high-temperature resistant adhesive, fundamentally solving the problems of high-temperature aging and delamination failure of traditional busbars

2. Ultra-Low Inductance Design, Unleashing the Potential of SiC Performance

Optimized for internal interconnection of SiC power modules, the laminated structure achieves extremely low parasitic inductance, effectively suppressing switching spikes and reducing EMI interference, fully releasing the high-speed switching advantages of SiC devices, and helping to boost both power density and efficiency.

3. Multi-Scenario Adaptation, Covering Core High-Power Fields

· SiC power modules: Internal integration, matching the high-temperature requirements at the chip level

· AI computing centers: High-density power supply systems, operating stably under long-term high-temperature loads

· Super charging stations: Reliable interconnection for high-current power modules under extreme temperature rise during fast charging

· High-density power electric drives: New energy vehicle/industrial motors, adapting to the harsh high-temperature and high-vibration in-vehicle environment

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 Why Choose A&J Link High-Temperature Laminated Busbars?

Application Scenarios

· SiC power modules: As the core internal interconnection component, realizing low-inductance and high-temperature-resistant connection between chips and terminals

· AI computing power supplies: High-density server power supplies, maintaining stable transmission under continuous high-temperature loads

· Super charging piles: High-current power modules, withstanding extreme temperature rise during fast charging

· New energy electric drives: On-board inverters/motor controllers, adapting to the high-temperature and high-vibration environment of electric drive systems

 About A&J Link

A&J Link specializes in the design, manufacturing, and technical services of laminated busbars. With independent innovation as the core, we provide customized power interconnection solutions for global customers. Our high-temperature laminated busbars are not only a breakthrough in materials and processes, but also the cornerstone of next-generation high-power electronic devices.

Making Power Transmission More Reliable, Efficient, and High-Temperature Resistant

A&J Link High-Temperature Laminated Busbars — Born for Extreme Scenarios