low inductance laminated busbar design

Low inductance laminated busbar design is a specialized engineering discipline focused on minimizing parasitic inductance. Our approach uses specific layout strategies and simulation-driven design to create busbars that are essential for the efficiency and reliability of modern high-frequency power converters.

Interleaved and Symmetric Layouts: The core of our design philosophy is the strategic arrangement of conductive layers. We implement interleaved DC-link designs where positive and negative layers are alternated, and create symmetric gate loop paths to cancel mutual inductance. This drastically reduces the effective loop area, the primary source of parasitic inductance.

Simulation-First Methodology: Before prototyping, we employ advanced electromagnetic field simulation software (e.g., ANSYS Q3D, CST) to model and extract the parasitic parameters (R, L, C) of the 3D busbar structure. This allows us to iterate the design virtually to achieve the target inductance and current density, minimizing development time and cost.

A purpose-driven low inductance laminated busbar design is not an accessory but a necessity for high-performance power electronics. Our simulation-validated designs provide a predictable, low-inductance path for current, directly enabling higher switching speeds, lower losses, and improved system stability.