Laminated Busbar Cost-Optimization Design Strategies


01/03

2026

When designing laminated busbars with cost reduction as the primary goal, a strategic balance must be struck between performance, reliability, and price. The core objective is to eliminate unnecessary expenses without compromising the busbar's fundamental function: to provide reliable power distribution with low inductance and low resistance for IGBT modules.


Here are the key strategies for achieving a high cost-performance laminated busbar design:

1. Material Selection and Optimization

This is the most significant area for cost savings.

  • Copper Thickness and Weight:
  • Insulation Material:
  • Surface Finish:

 

2. Design Simplification and Standardization

Complexity increases processing time and cost.

  • Geometry and Bending:
  • Optimizing Current Path and Direction

This is the most critical part of electrical design, aimed at reducing path resistance and inductance, and achieving uniform current distribution.

Path Minimization and Loop Area Reduction:

  • Optimizing Layout and Simplifying Design

This part focuses on optimizing the physical structure to achieve the aforementioned electrical goals.

  • Laminated Structure Optimization:

 

3. Manufacturing Process Efficiency

Design for Manufacturability is crucial.

  • Panelization (Nesting):
  • Adhesive and Lamination Process:

 

4. Supplier Collaboration and Volume

  • Early Involvement:​ Involve your busbar supplier early in the design process. Their expertise can help you avoid costly design choices and suggest more cost-effective alternatives that meet your electrical and mechanical needs.
  • Volume Leverage:​ Like most components, the unit cost decreases with increasing volume. Develop production volume plans and negotiate price tiers with your supplier.

Cost vs. Performance Trade-Offs: Summary Table

Design Choice

High-Cost / High-Performance Option

Lower-Cost Alternative

Key Trade-Off

Conductor Material​

Thicker copper

Thinner, optimized via simulation; Potential use of aluminum

Higher resistive losses, increased temperature rise

Insulation Material​

Polyimide (Kapton®)

PET (Polyester)

Lower maximum operating temperature, lower dielectric strength

Surface Finish​

Electrolytic Nickel/Silver/Gold

Tin plating, Passivation

Potential oxidation risk, reduced shelf life, slightly higher contact resistance

Design Complexity​

Complex 3D shapes, many custom features

Simple, planar design, standard features

May require compromise on mechanical layout

Plating Coverage​

Full-body plating

Selective plating only on contact areas

Reduced corrosion protection on non-critical areas

 

Conclusion: 

The "Smart Cost" Optimization Approach

Designing a laminated busbar for cost is not about choosing the cheapest option for every component. It's about smart optimization—understanding where money can be saved without introducing risk to the system.

The most cost-effective design is one that:

  1. Meets​ the electrical and thermal performance specifications with an appropriate (not excessive, over-designed) safety margin.
  2. Is easy to manufacture​ with high yield.
  3. Uses standard, readily available materials.
  4. Results from close collaboration​ between the design engineer and the busbar manufacturer.

By focusing on these aspects, you can achieve significant cost savings while maintaining the critical protective benefits for your IGBT modules. For customized cost-optimized designs, it is best to consult directly with an experienced manufacturer like A&J LINK Technologies.

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